Compact resin-sealed semiconductor device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jul 4, 2000
Grant Date -
N/A
app pub date -
Dec 8, 1997
filing date -
Apr 21, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A semiconductor device of the present invention is structured such that solder balls for packaging are fixed onto leads protruding from a package to obviate drawbacks inherent in the conventional lead frame type semiconductor device, wherein it is difficult to correspond to the layout of the increased number of pins due to an occurrence of flexure of the lead, and protrusions of the lead terminals from the package resin are disadvantageous for downsizing.
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