US Patent No: 6,084,300

Number of patents in Portfolio can not be more than 2000

Compact resin-sealed semiconductor device

Stats

ATTORNEY / AGENT: (SPONSORED)
 

Importance

Loading Importance Indicators... loading....

Abstract

A semiconductor device of the present invention is structured such that solder balls for packaging are fixed onto leads protruding from a package to obviate drawbacks inherent in the conventional lead frame type semiconductor device, wherein it is difficult to correspond to the layout of the increased number of pins due to an occurrence of flexure of the lead, and protrusions of the lead terminals from the package resin are disadvantageous for downsizing.

Loading the Abstract Image... loading....

First Claim

Related Publications

Loading Related Publications... loading....

Patent Owner(s)

Patent OwnerAddressTotal Patents
OKI ELECTRIC INDUSTRY CO., LTD.TOKYO1737

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Oka, Takahiro Kawasaki, JP 46 309

Cited Art

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (2)
5,751,060 Electronic package 26 1997
5,900,675 Organic controlled collapse chip connector (C4) ball grid array (BGA) chip carrier with dual thermal expansion rates 50 1997
 
NEC CORPORATION (2)
5,668,405 Semiconductor device with a film carrier tape 178 1995
5,777,387 Semiconductor device constructed by mounting a semiconductor chip on a film carrier tape 24 1997
 
AMKOR TECHNOLOGY, INC. (1)
5,433,822 Method of manufacturing semiconductor device with copper core bumps 27 1992
 
BRECONRIDGE CORPORATION (1)
5,901,041 Flexible integrated circuit package 78 1997
 
FREESCALE SEMICONDUCTOR, INC. (1)
5,541,450 Low-profile ball-grid array semiconductor package 140 1994
 
HITACHI, LTD. (1)
5,895,965 Semiconductor device 37 1997
 
MITSUI HIGH-TEC, INC. (1)
5,717,252 Solder-ball connected semiconductor device with a recessed chip mounting area 86 1996
 
MOTOROLA, INC. (1)
5,045,914 Plastic pad array electronic AC device 25 1991
 
MUCHOSTRO FOUNDATION, L.L.C. (1)
5,847,455 Molded leadframe ball grid array 31 1995
 
NANYA (1)
5,677,566 Semiconductor chip package 329 1995
 
RENESAS ELECTRONICS CORPORATION (1)
5,608,265 Encapsulated semiconductor device package having holes for electrically conductive material 228 1994
 
SAMSUNG ELECTRONICS CO., LTD. (1)
5,594,275 J-leaded semiconductor package having a plurality of stacked ball grid array packages 135 1994
 
SONY CORPORATION (1)
5,886,399 Lead frame and integrated circuit package 33 1996

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
OKI SEMICONDUCTOR CO., LTD. (4)
6,555,923 Semiconductor chip having pads with plural junctions for different assembly methods 4 2002
7,344,968 Semiconductor chip having pads with plural junctions for different assembly methods 1 2002
7,309,915 Semiconductor chip having pads with plural junctions for different assembly methods 0 2005
7,288,846 Semiconductor chip having pads with plural junctions for different assembly methods 0 2005
 
ULTRATECH, INC. (3)
7,253,510 Ball grid array package construction with raised solder ball pads 1 2003
7,816,754 Ball grid array package construction with raised solder ball pads 0 2007
8,153,516 Method of ball grid array package construction with raised solder ball pads 0 2010
 
M/A-COM TECHNOLOGY SOLUTIONS HOLDINGS, INC. (2)
6,828,658 Package for integrated circuit with internal matching 4 2002
6,903,447 Apparatus, methods and articles of manufacture for packaging an integrated circuit with internal matching 0 2003
 
MICRON TECHNOLOGY, INC. (2)
7,087,995 Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages 0 2003
7,470,563 Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages 0 2005
 
FUJITSU LIMITED (1)
6,522,016 Interconnection structure with film to increase adhesion of the bump 1 2000
 
INTEGRATED DEVICE TECHNOLOGY, INC. (1)
6,975,527 Memory device layout 1 2002
 
NEC ELECTRONICS CORPORATION (1)
6,246,117 Semiconductor device comprised of a ball grid array and an insulating film with preformed land openings 4 1999
 
NIHON DEMPA KOGYO CO., LTD. (1)
8,064,221 Electronic devices for surface mount 0 2008
 
QIMONDA AG (1)
6,953,893 Circuit board for connecting an integrated circuit to a support and IC BGA package using same 0 2004
 
SONY CORPORATION (1)
6,469,393 Semiconductor package and mount board 14 1999
 
STATS CHIPPAC LTD. (1)
7,863,737 Integrated circuit package system with wire bond pattern 0 2006