Method and apparatus for reducing resin bleed during the formation of a semiconductor device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 4, 2000
Grant Date -
N/A
app pub date -
May 22, 1997
filing date -
May 22, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor device assembly having a support such as a lead frame paddle comprises a coating thereon to reduce or eliminate the flow of die attach adhesive from under the die and over bond sites or encapsulation regions. Thus undesirable effects resulting from this flow of adhesive, such as wire bonding problems and encapsulation problems, are reduced. A method for forming the assembly is also described.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully