Ground and power patches on printed circuit board signal planes in the areas of integrated circuit chips
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 4, 2000
Grant Date -
N/A
app pub date -
Oct 2, 1998
filing date -
Oct 2, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention is a multi-level printed circuit board (PCB) containing at least one power plane for conducting and distributing electrical power and at least one ground plane, spaced apart from the power plane, for providing and distributing an electrical ground. At least one integrated circuit chip is mounted on the printed circuit board. At least one signal plane is spaced apart from both the power plane and the ground plane, for conducting and distributing electrical signals from a first point to a second point. The signal plane(s) each have a portion or 'patch' that is electrically isolated from signal traces in the remainder of the signal plane. The patches are placed in the area underneath the integrated circuit chip. The patches are connected, respectively, to the power plane or to the ground plane, for reducing effective inductance and input impedance. The multi-level PCB has one or more plated through hole vias for connecting the power or ground plane to a patch. Decoupling capacitors may be provided between the sets of plated through hole vias to further reduce input impedance.
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