Wire bond monitoring system for layered packages
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jul 11, 2000
Issued Date -
N/A
app pub date -
Sep 8, 1997
filing date -
Sep 8, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A wire bond monitoring system for monitoring wire bonds made on layered packages includes a technique for accessing both the die and the laminate package and making electrical contact thereto so as to test the continuity of the wire bond connection. An electrical connection can be made to a metal trace between the die and the laminate package by contacting a via extending downwardly through the package. Alternatively, a contact may be made from above using a flexible contact. The flexible contact may be attached to the wire bond clamp.
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