Using microspheres as a stress buffer for integrated circuit prototypes
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United States of America Patent
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Jul 11, 2000
Grant Date -
N/A
app pub date -
Aug 13, 1998
filing date -
Aug 13, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A process for packaging a die uses compressible microspheres to form a stress buffer layer between the die and an epoxy encapsulant to absorb stresses on the die caused by the different thermal expansion rates of the epoxy and die during temperature changes. By using a compressible layer of microspheres or other material, the need for a nitride passivation or other insulating layer to protect the die from thermally-induced stress is eliminated. In addition, the number and size of the microspheres and the amount of epoxy used to seal the package can be adjusted so that the epoxy is approximately co-planar with the top of the package to allow the package to be handled and used with standard equipment and processes.
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