Laser machining apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6087625
SERIAL NO

09042949

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A pulsed laser beam from a laser oscillator 10 is split into two by a beam splitter 13. The split laser beams are radiated by X-Y scanners 14 and 16 through working lenses 17 and 18 onto a work 20. Additionally on the work, the laser beams are swung in X-axis and Y-axis directions. These X-Y scanners simultaneously process a plurality of process regions which are divided and set on the work.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO HEAVY INDUSTRIES LTDTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Iso, Keiji Hiratsuka, JP 4 152

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