Bond pad for a flip-chip package
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United States of America Patent
Stats
-
Jul 11, 2000
Grant Date -
N/A
app pub date -
Sep 28, 1998
filing date -
Sep 28, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A bond pad support structure is located beneath a bond pad on an integrated circuit. The bond pad support structure includes a first bond pad support layer at least partly located below the bond pad. The first bond pad support layer has a plurality of radial patterns with at least one space between the radial patterns. The radial patterns may be, for example, straight lines having approximately uniform thickness. Alternatively, the radial patterns may be triangles, each of which has an apex pointing to the center of a region below the bond pad. The radial patterns may have a plurality of different lengths. A second bond pad support layer is located on the first bond pad support layer. The second bond pad support layer fills at least a portion of the space between the radial patterns.
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