Heat sink with integrated buss bar
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jul 11, 2000
Grant Date -
N/A
app pub date -
May 22, 1998
filing date -
Jun 7, 1995
priority date (Note) -
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status (Latency Note)
Importance
Abstract
The invention centers around a circuit board assembly having a heat sink with a buss bar integrally formed therein. The heat sink is provided between two parallel, opposed circuit boards. The buss bar is provided between the two circuit boards and is in electrical contact with circuit modules provided on both circuit boards. The buss bar is electrically insulated from both the circuit boards and the heat sink but electrically connected to the circuit modules.
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