Electroplating method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jul 18, 2000
Grant Date -
N/A
app pub date -
Mar 26, 1998
filing date -
Mar 31, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of electroplating an object to be plated attached to a lower portion of a plating bath constituted by draining used plating solution and supplying new plating solution at every plating procedure. The method has a step of supplying additional current so that the object to be plated always has cathode potential, while the object to be plated is being dipped in the plating bath and electroplating is not carried out.
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