Method and apparatus for controlling plating over a face of a substrate
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United States of America Patent
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Jul 18, 2000
Issued Date -
N/A
app pub date -
May 21, 1998
filing date -
May 26, 1995
priority date (Note) -
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status (Latency Note)
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Abstract
According to aspect of the invention, a plating system is provided which includes a tank for containing a plating solution, a shaft extending into the tank, and a substrate holder mounted to the shaft. The shaft and the tank are rotatable relative to one another. The substrate holder is configured to support a substrate in position so that at least a first face of the substrate is exposed to the plating solution in the tank.
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