Thermal microplatform

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United States of America Patent

PATENT NO 6091050
SERIAL NO

08972055

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Abstract

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A micromachined platform structure includes a substrate having a major surface and a platform positioned over the major surface. Plural support beams are tethered between the substrate and the platform, with each support beam including at least a first layer exhibiting a first thermal coefficient of expansion (TCE) and a second layer with a second TCE, the first TCE greater than the second TCE. The first layer is deposited on the second layer at a temperature that is higher than an ambient temperature at which the platform is to be used. Thus, at the ambient use temperature, the first layer is in a contraction/tension state relative to the second layer and causes a flexure of the support beams and an elevation of the platform away from the substrate's major surface.

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Patent Owner(s)

Patent OwnerAddress
MULTISPECTRAL IMAGING INC283 WEST SHORE TRAIL SPARTA NJ 07871

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Carr, William N Montclair, NJ 64 1983

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