Method of manufacturing printed circuits
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jul 25, 2000
Issued Date -
N/A
app pub date -
Jun 14, 1999
filing date -
Feb 14, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Methods of facilitating commercial production of supported conductive networks without the use of hazardous chemicals including using heat flowable adhesive in the formation of the networks, providing contact pads exposed through a dielectric substrate which supports a conductive network, using the thickness of a conductor supporting dielectric layer to space the conductors and providing conductor and waste material cross-sections trapezoidal in shape in a non-planar pattern during manufacture of the networks.
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