Importance

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Abstract

The present invention discloses a face-to-face (FTF) stacked integrated circuit (IC) assembly. The FTF stacked IC assembly includes a first and a second substrate-on-bare-chip (SOBC) modules. Each of the first and second SOBC modules includes a printed circuit board (PCB) having a PCB bottom surface overlying an active circuit surface of a bare integrated circuit (IC) chip. The PCB includes a window opened substantially in a central portion of the active circuit surface of the bare IC chip. The bare IC chip includes bare-chip bonding-pads disposed on the active circuit surface in the window and the PCB includes a plurality of PCB bonding pads. Each of the first and second SOBC modules includes a plurality of bonding wires interconnecting the bare-chip bonding pads to the PCB bonding pads. Each of the first and second SOBC modules includes a plurality of solder balls disposed on a PCB top surface of the PCB connected to the PCB bonding pads with a plurality of metal traces disposed on the PCB board. The solder balls of first SOBC module mounted on the solder balls of the second SOBC module constituting a face-to-face (FTF) stacked SOBC assembly.

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First Claim