Package with integrated thermoelectric module for cooling of integrated circuits
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Aug 1, 2000
Grant Date -
N/A
app pub date -
Jan 4, 1999
filing date -
Jan 4, 1999
priority date (Note) -
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Abstract
A package for an integrated circuit (IC) comprises a lid attached to a base, with the IC being disposed in a space or cavity between the lid and the base. A thermoelectric module (TEM) having first and second primary surfaces is incorporated into a section of the lid. The first primary surface is thermally coupled to the IC such that application of power to the TEM causes heat to be transferred away from the IC.
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