Importance

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Abstract

A size-convertible device for supporting wafers in a parallel relationship includes a removable insert that enables the device to be non-destructively switched from providing edge support for large diameter wafers to providing edge support for small diameter wafers. The insert maintains the original wafer pitch and the original insertion angle. In the preferred embodiment, the device is a Front Opening Unified Pod (FOUP) specifically designed for use with 300 mm diameter wafers. Inserts are releasably attached to opposite sides of the FOUP to convert the device to a 200 mm diameter pod. The axis of the rest positions of the small wafers is coaxial with the rest positions of the large wafers. However, the inserts may be adapted to move the rest positions of the small wafers forwardly to a position such that there is front edge alignment with respect to rest positions of the large and small wafers.

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First Claim