Orbital motion chemical-mechanical polishing method and apparatus
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United States of America Patent
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Aug 1, 2000
Issued Date -
N/A
app pub date -
Feb 1, 1996
filing date -
Aug 6, 1993
priority date (Note) -
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Abstract
A method and apparatus for polishing a thin film formed on a semiconductor substrate. A table covered with a polishing pad is orbited about an axis. Slurry is fed through a plurality of spaced-apart holes formed through the polishing pad to uniformly distribute slurry across the pad surface during polishing. A substrate is pressed face down against the orbiting pad's surface and rotated to facilitate, along with the slurry, the polishing of the thin film formed on the substrate.
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