Method of dicing wafer level integrated multiple optical elements
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United States of America Patent
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Aug 1, 2000
Grant Date -
N/A
app pub date -
Oct 3, 1997
filing date -
Sep 27, 1996
priority date (Note) -
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Abstract
Integrated multiple optical elements may be formed by bonding substrates containing such optical elements together or by providing optical elements on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignment features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level.
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