Inter-conductive layer fuse for integrated circuits
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United States of America Patent
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Aug 1, 2000
Grant Date -
N/A
app pub date -
Apr 22, 1998
filing date -
Apr 22, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method and structure for customizing or repairing integrated circuits using passivated tungsten fuses and low-power energy beams to select which tungsten fuses are to be removed. The tungsten fuses are formed in an array to connect possible connection points of the device. A low-power energy source then selects undesired connection points, and a conventional etch removes the selected tungsten fuses, thereby customizing or repairing the integrated circuit. Because neither precision custom masks nor high energy laser sources are required, the problems associated with conventional methods are reduced or eliminated.
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