Methods of making microelectronic corrections with liquid conductive elements
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United States of America Patent
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Aug 1, 2000
Issued Date -
N/A
app pub date -
Mar 31, 1998
filing date -
May 2, 1996
priority date (Note) -
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Abstract
A method of making a microelectronic assembly includes providing a first element and a second element with confronting, spaced-apart interior surfaces defining a space therebetween and contacts on the interior surfaces and masses of an electrically conductive material having a melting temperature below about 125.degree. C. in the space so that each mass is disposed between a contact on the first element and a contact on the second element and so that the masses electrically connect the contacts to one another. A flowable liquid material is then introduced around the masses and between the confronting surfaces, and the liquid material is then cured to form a compliant dielectric layer disposed between the confronting surfaces and intimately surrounding each mass.
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