Method and apparatus for conductively joining components
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Aug 1, 2000
Grant Date -
N/A
app pub date -
Feb 18, 1998
filing date -
Feb 18, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A flexible conductive tape is coated on at least one surface with an electrically conductive adhesive. The adhesive includes conductive particles dispersed therein. The adhesive-coated surface of a first segment of the flexible tape is joined to a substrate. The flexible tape is folded back at a crease, to expose a portion of the adhesive surface. At least one module is affixed to the exposed adhesive surface of the adjacent tape segment to form a sub-assembly. The sub-assembly is adapted for interengagement with a complementary modular assembly including electrical components and connectors. An electrical current is provided to the flexible tape.
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