Semiconductor device having magnetic shield layer circumscribing the device
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United States of America Patent
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-
Aug 1, 2000
Grant Date -
N/A
app pub date -
Oct 19, 1998
filing date -
Apr 24, 1996
priority date (Note) -
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status (Latency Note)
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Abstract
It is the object to minimize a magnetic influence, on the outside, of a semiconductor chip which is formed on a substrate includes inductor conductors. A semiconductor chip 2 including inductor conductors is mounted on a substrate 1 and a plurality of through holes 8 are formed in the area on the outside of the mounting position. Shielding members 4 are formed on the chip mounting side and the opposite side of the substrate 1 and in the through holes 8 so as to cover the semiconductor chip 2 with the shielding members 4 from both sides of the substrate 1. Therefore, magnetic fluxes from a circuit formed on the semiconductor chip 2 do not leak out from the shielding members 4, but circulate inside the shielding members 4.
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