Semiconductor plastic package, metal plate for said package, and method of producing copper-clad board for said package
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United States of America Patent
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Aug 1, 2000
Grant Date -
N/A
app pub date -
Jan 27, 1999
filing date -
Jan 28, 1998
priority date (Note) -
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Abstract
There is provided a semiconductor plastic package in the form in which at least one semiconductor chip is mounted on a small-sized printed wiring board, a metal plate for the above package and a method of producing a copper-clad board for the above package. More particularly, there is provided a semiconductor plastic package suitable for relatively high-watt, multi-terminal and high-density semiconductor plastic packages such as a microprocessor, a micro-controller, ASIC and graphic, and a method of producing the same.
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