Die interconnections using intermediate connection elements secured to the die face
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 1, 2000
Grant Date -
N/A
app pub date -
Feb 14, 1997
filing date -
Feb 14, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor device, such as an integrated circuit die, includes a plurality of bond pads on an active surface thereof electrically connected to internal circuitry of the semiconductor device, and a plurality of jumper pads on the active surface which are electrically isolated from internal circuitry of the die. The jumper pads effectively provide stepping stones for wire bonds to be made across the active surface between bond pads. The jumper pads may be formed directly on the semiconductor device or on a non-conductive support structure that is attached to the semiconductor device.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully