Heat sink for direct attachment to surface mount electronic device packages
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United States of America Patent
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-
Aug 1, 2000
Grant Date -
N/A
app pub date -
Oct 22, 1997
filing date -
Oct 22, 1997
priority date (Note) -
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Abstract
A heat sink adapted to thermally couple to a surface mounted heat generating electronic device package in a manner which provides an increased thermal path between the heat sink and the electronic device package. The heat sink is typically mounted piggyback on a heat generating electronic device package which is surface mounted to a printed circuit board or other substrate. The heat sink comprises thermal legs which extend from the heat sink body and are thermally coupled to thermal leads of the heat generating electronic device package.
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