Radio frequency module with thermally and electrically coupled metal film on insulating substrate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 1, 2000
Grant Date -
N/A
app pub date -
Jun 11, 1997
filing date -
Jun 13, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The radio frequency module of the present invention includes an insulating substrate having a first metal film on a first principal surface thereof and a second metal film on a second principal surface thereof opposed to the first principal surface and a semiconductor device. The semiconductor device is thermally and electrically coupled to the second metal film, and a thickness of the second metal film is larger than that of the first metal film.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully