Method of manufacturing a semiconductor device and an apparatus for manufacturing the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 8, 2000
Grant Date -
N/A
app pub date -
Dec 26, 1996
filing date -
Dec 27, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In a CMP process for flatting a surface of a film on a semiconductor wafer, ionized water is used as rinsing liquid in the post-polishing step performed after the main CMP polishing step. With ionized water as rinsing liquid, abrasive particles adhered to the film surface during the main polishing step are removed.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully