Manufacture method for micromechanical devices
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United States of America Patent
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-
Aug 8, 2000
Issued Date -
N/A
app pub date -
Jun 7, 1995
filing date -
Sep 23, 1994
priority date (Note) -
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Abstract
A process for manufacturing micromechanical devices. The process includes the step of covering the activation circuitry (201) and those parts of the device that come in contact with moving parts with a pad film (202). The pad film prevents frictional wear and sticking of the moving parts, and can prevent electrical shorts between different parts of the activation circuitry. Additionally, the pad film can prevent particulates from interfering with the operation of the device.
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