Method of making microwave, multifunction modules using fluoropolymer composite substrates
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United States of America Patent
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Aug 8, 2000
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N/A
app pub date -
Nov 25, 1998
filing date -
Feb 13, 1998
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Abstract
A platform is provided for the manufacture of microwave, multilayer integrated circuits and microwave, multifunction modules. The manufacturing process involves bonding fluoropolymer composite substrates into a multilayer structure using fusion bonding. The bonded multilayers, with embedded semiconductor devices, etched resistors and circuit patterns, and plated via holes form a self-contained surface mount module. Film bonding, or fusion bonding if possible, may be used to cover embedded semiconductor devices, including embedded active semiconductor devices, with one or more layers.
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