Photopolymerizable compositions for encapsulating microelectronic devices
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United States of America Patent
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Aug 8, 2000
Issued Date -
N/A
app pub date -
Aug 7, 1998
filing date -
Jun 6, 1995
priority date (Note) -
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Abstract
A novel method for producing thick composite parts based upon photopolymerizable compositions is disclosed. Also disclosed are novel methods for encapsulation of microelectronic devices based upon novel photopolymerizable compositions. The constituents of the photopolymerizable mixture comprise a monomer or monomers capable of polymerizing by free radical or cationic mechanisms, and a photoinitiator system which possesses an absorbance characteristic which is effectively reduced, or self-eliminating, upon initiation of the polymerization reaction. Parts having thicknesses up to 2 cm and thicker for varying end use applications are made by photopolymerizing such compositions. In addition, using such compositions composite parts can be made using a reinforcement material such as a glass fiber mat present in an amount by weight of from about 5 to about 70%.
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