Method of fabricating electronic circuit device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Aug 8, 2000
Grant Date -
N/A
app pub date -
Feb 17, 1998
filing date -
Feb 17, 1997
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic circuit device fabrication method securing a bond width of a seal portion when heat treatment is needed in sealing a device cavity by a cap. An electronic part mounting step is executed to secure electronic parts, including a semiconductor acceleration sensor chip, within a package main body by using a silicone group die bonding material and a silicone group silver paste. At a baking step, the package main body mounted with the electronic part is heated to a baking temperature of about 380.degree. C..+-.5.degree. C. In a sealing step, the package main body and the cap are bonded by a sealing material by executing a heat treatment in a state where the sealing material, comprising a low melting point glass, is interposed between a peripheral edge portion of the cavity in the package main body and the cap. The temperature of the package main body is then heated in the heat treatment to about 365.degree. C..+-.5.degree. C., which is lower than the baking temperature at the baking step.
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