Process for producing semiconductor article
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United States of America Patent
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Aug 8, 2000
Grant Date -
N/A
app pub date -
Dec 18, 1997
filing date -
Dec 18, 1996
priority date (Note) -
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Abstract
A process for producing a semiconductor article is provided which comprises the steps of bonding a film onto a substrate having a porous semiconductor layer, and separating the film from the substrate at the porous semiconductor layer by applying a force to the film in a peeling direction.
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