US Patent No: 6,100,581

Number of patents in Portfolio can not be more than 2000

Semiconductor chip packaging having printed circuitry or printed circuit registration feature

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Importance

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Abstract

A semiconductor device comprising at least one semiconductor chip, the or each semiconductor chip having a plurality of chip bonding pads, a package which encloses the at least one semiconductor chip, a first level interconnect comprising a printed circuit which overlies the at least one semiconductor chip in the package and extends externally of the package to provide a plurality of outer leads, and a second level interconnect comprising means for electrically connecting the chip bonding pads to selected contacts on the printed circuit, which contacts overlie the at least one semiconductor chip. The invention also relates to a method of manufacturing such a semiconductor device and to a method of assembling a semiconductor assembly.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
SGS-THOMSON MICROELECTRONICS LIMITEDBRISTOL171
STMICROELECTRONICS, INC.CARROLLTON, TX1257

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wakefield, Elwyn Paul Michael Norfolk NR19, 1JB, GB 2 7
Walker, Christopher Paul Hulme Milton Keynes, GB 13 123

Cited Art

Patent Info (Count) # Cites Year
 
MATSUSHITA ELECTRIC WORKS, LTD. (2)
4,890,152 Plastic molded chip carrier package and method of fabricating the same 49 1987
4,868,638 Plastic molded pin grid chip carrier package 37 1987
 
MOTOROLA, INC. (2)
5,045,921 Pad array carrier IC device using flexible tape 188 1989
5,018,005 Thin, molded, surface mount electronic device 47 1989
 
FUJITSU LIMITED (1)
4,751,482 Semiconductor integrated circuit device having a multi-layered wiring board for ultra high speed connection 70 1986
 
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (1)
4,914,741 Tape automated bonding semiconductor package 10 1987
 
MITSUBISHI DENKI KABUSHIKI KAISHA (1)
4,941,033 Semiconductor integrated circuit device 70 1989
 
NATIONAL SEMICONDUCTOR CORPORATION (1)
4,890,153 Single bonding shelf, multi-row wire-bond finger layout for integrated circuit package 34 1986
 
STMICROELECTRONICS, INC. (1)
5,073,816 Packaging semiconductor chips 22 1990
 
TEXAS INSTRUMENTS INCORPORATED (1)
4,903,120 Chip carrier with interconnects on lid 27 1985
 
XOC Devices, Inc. (1)
4,953,005 Packaging system for stacking integrated circuits 134 1988

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
ALTERA CORPORATION (1)
6,351,144 Programmable logic device with unified cell structure including signal interface bumps 2 2000
 
ELPIDA MEMORY, INC. (1)
6,476,482 Chip-size integrated circuit package having slits formed in an insulator tape 0 2000
 
KABUSHIKI KAISHA TOSHIBA (1)
6,459,157 Semiconductor device and double-sided multi-chip package 0 2000
 
STATS CHIPPAC LTD. (1)
7,701,042 Integrated circuit package system for chip on lead 0 2007