Importance

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Abstract

An improved multi-electronic device package for accommodating multiple electronic devices such as integrated circuits, memory chips, or the like, is disclosed. The package includes a thermally and electrically conductive plane positioned between a first substrate and a second substrate. A first electronic device is secured to a first surface of the plane within an opening in the first substrate, and a second electronic device is secured to an opposed second surface of the plane within an opening in the second substrate. The electronic device package includes solder balls attached to the second substrate for electrically coupling and physically attaching the electronic device package to a third circuitized substrate, and solder balls attached to the first substrate for electrically coupling and physically attaching the electronic device package to a second electronic device package in a stacked configuration.

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First Claim