Laser bar structure and method of fabrication
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 8, 2000
Grant Date -
N/A
app pub date -
Mar 31, 1998
filing date -
Mar 31, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A plate of metal is bonded to a plate of and electrical insulator and the metal is cut through into a plurality of parallel channels, or recesses, each of a dimension to receive a laser diode (bar). A laser diode is positioned in each of the channels and a solder preform, positioned on the top of the laser diode bars. Is heated to flow around each laser diode bar to secure it in place. A highly manufacturable laser diode assembly having a higher heat capacity results for bonding to a heat sink.
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