Semiconductor unit and method for manufacturing the same
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United States of America Patent
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Aug 15, 2000
Grant Date -
N/A
app pub date -
Oct 3, 1997
filing date -
Mar 6, 1996
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A semiconductor unit, in which a semiconductor device having protruding electrodes is mounted face down onto the terminal electrodes of a circuit board through a bonding layer made of at least two kinds of conductive adhesive, and a method for manufacturing the semiconductor unit.
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