Heat treating apparatus
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United States of America Patent
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Aug 15, 2000
Issued Date -
N/A
app pub date -
Jul 15, 1998
filing date -
May 12, 1995
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A substrate heat treating apparatus with a substrate support plate having a plurality of holes, a heating element to heat the substrate through the support plate, and substrate support pins extending through the plurality of holes in the support plate. Each support pin is mounted so that it is slidable in a horizontal direction within each of the plurality of holes in the support plate.
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