Complementary wiring package and method for mounting a semi-conductive IC package in a high-density board
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United States of America Patent
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-
Aug 15, 2000
Grant Date -
N/A
app pub date -
Jun 15, 1998
filing date -
Jun 13, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A complementary wiring package including a package, a first set of external pins mounted in a central region on a top surface of the package in a vertical direction and connected to a plurality of respectively corresponding through holes, a second set of external pins being mounted in a perimeter region on a top surface of the package in a vertical direction and connected to printed wiring of a printed wiring board, and a plurality of internal lines that connect the first set of external pins to the second set of external pins. The complementary wiring package does not require a semi-conductor integrated circuit and is capable of being coupled with an semi-conductor integrated circuit package via the plurality of respectively corresponding through holes of the printed wiring board which is sandwiched between the complementary wiring package and the semi-conductor integrated circuit package.
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