Test apparatus for electronic components
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Aug 15, 2000
Grant Date -
N/A
app pub date -
May 16, 1996
filing date -
May 16, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A test apparatus (1) has a temperature controlled chuck (8) which provides good mechanical stability across a wide temperature range. This significantly reduces the number of times the probes (9) must be re-positioned, and in some cases eliminates such re-positioning. The chuck (8) has a support plate (20) which is connected to a base plate (35) by pillars (40) which have a low thermal expansion coefficient. This limits thermal expansion between the support plate (20) and the base plate (35). In addition, the heat transfer means is mounted so that thermal expansion is accommodated internally.
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