Apparatus for retaining a subtrate in a semiconductor wafer processing system and a method of fabricating same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 15, 2000
Grant Date -
N/A
app pub date -
Apr 21, 1998
filing date -
Apr 21, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An electrostatic chuck including a body of ceramic and a metal backing portion for mounting the chuck directly to a metal pedestal and a process of manufacturing the electrostatic chuck using sintering. The electrostatic chuck contains a metal backing portion having at least one hole extending therethrough and the body of ceramic includes at least one portion extending through the hole.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully