Molding apparatus with charge overflow

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United States of America Patent

PATENT NO 6106274
SERIAL NO

09038588

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Abstract

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A transfer/injection molding apparatus is defined that includes a charge forming unit, a molding unit and a charge overflow unit. The charge is formed so that the fibers therein are randomly oriented in substantially parallel horizontal planes such that they are always substantially parallel to the direction of initial flow into the cavity of the molding unit. Excess charge from the cavity is forced into the charge overflow unit, which is selectively located in an area where surface finish is less critical. The excess charge displaces an overflow pin, which is kept upwardly biased, under molding pressure, to be flush with the lower inside wall of the molding unit cavity.

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Patent Owner(s)

Patent OwnerAddress
BUDD COMPANY THE3155 W BIG BEAVER ROAD TROY MI 48084

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bodary, Joseph A Utica, MI 6 38
Freeman, Richard Benjamin Oxford, MI 6 77
Ingham, Terry L Oxford, MI 12 179
Morse, John J Leonard, MI 3 27
Ritchie, Jack J Washington, MI 11 220

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