Method and apparatus for reactive sputtering employing two control loops
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United States of America Patent
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Aug 22, 2000
Grant Date -
N/A
app pub date -
Apr 16, 1998
filing date -
Apr 16, 1998
priority date (Note) -
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Abstract
The present invention is a cascade control system for reactive sputtering deposition. A first control loop modifies the power supply in order to keep a monitored value nearly constant. This first control loop can be done relatively quickly. A second control loop monitors a second measure parameter in order to control the reactive gas flow to the system. In a preferred embodiment, the slower control loop is used to maintain a relatively constant power at the power supply.
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