Integrated flexible interconnection
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United States of America Patent
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Aug 22, 2000
Grant Date -
N/A
app pub date -
May 28, 1998
filing date -
May 28, 1998
priority date (Note) -
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Abstract
A method of creating a plurality of fine pitch integrated interconnects utilizes a flexible layer to create a plurality of integrated interconnects which extend beyond the boundary of the integrated circuit chip onto the substrate. Subsequently, a support layer is deposited on the interconnects and the substrate under the plurality of interconnects which is located beyond the boundary of the integrated circuit chip is removed.
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