Duplex feedthrough and method therefor
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Aug 29, 2000
Grant Date -
N/A
app pub date -
Jun 15, 1998
filing date -
Jun 15, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A conductive feedthrough for providing electrical current to semiconductor packages. A conductive wall portion of a semiconductor package contains an insulating material disposed in an aperture in the conductive wall. The insulating material has an axial bore into which an electrical conductor is inserted. The conductor has a reduced diameter in the portion inside the axial bore and enlarged portions on either side of the axial bore.
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