Antifuse structure suitable for VLSI application

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6111302
SERIAL NO

08521252

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention relates to a high performance, high reliability antifuse using conductive electrodes. The problem of switch-off of the programmed antifuses is solved by reducing the thermal conductivity of the conductive electrodes. This is achieved by using lower thermal conductivity conductors for the electrodes or by using thinner electrodes to increase thermal resistance. According to a first aspect of the present invention, the problem of switch-off in conductor-to-conductor antifuses is solved by utilizing conductive electrode materials having a relatively lower thermal conductivity than prior art electrode materials. According to a second aspect of the present invention, the problem of switch-off in conductor-to-conductor antifuses is solved by utilizing relatively thin electrodes, thus increasing their thermal resistance. According to a third aspect of the present invention, a relatively thin barrier layer is placed between one or both of the low thermal conductivity electrodes and the antifuse material in order to prevent reaction between the conductive electrodes and the antifuse material or the materials used in manufacturing such as the etch gas. According to a fourth aspect of the present invention low thermal conductivity conductors are used for both electrodes in the conductor-to-conductor antifuse in order to achieve enhanced reliability and freedom from switch-off. According to a fifth aspect of the present invention switch-off is cured in conductor-to-conductor antifuses without compromising low on-state resistance of the antifuse.

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Patent Owner(s)

  • ACTEL CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chiang, Steve S Saratoga, CA 49 1847
Hu, Chenming Alamo, CA 187 9962
Zhang, Guobiao Elcerrito, CA 251 2733

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