Reworkable thermoplastic encapsulant
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Aug 29, 2000
Grant Date -
N/A
app pub date -
Dec 30, 1997
filing date -
Dec 30, 1997
priority date (Note) -
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status (Latency Note)
Importance
Abstract
The invention is an encapsulated circuit assembly including a chip; a substrate; at least one solder joint which spans between the chip and the substrate forming an electrically conductive connection between the chip and the substrate; and an encapsulant formed adjacent the solder joint, wherein the encapsulant comprises a thermoplastic polymer formed by ring opening polymerization of a cyclic oligomer.
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