Integrated carrier ring/stiffener and method for manufacturing a flexible integrated circuit package
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United States of America Patent
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Aug 29, 2000
Grant Date -
N/A
app pub date -
Feb 5, 1998
filing date -
Feb 5, 1998
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A carrier ring provides a stiffening function for assembling flexible circuits or semi-rigid circuits. The carrier ring is attached to a substrate adapted for attachment of a matrix of semiconductor dies. The carrier ring is provided with mold gates and mold vents for use with a transfer molding step to provide encapsulation for the semiconductor dies. Alignment and indexing marks on the carrier ring allows use of conventional assembly process flows in conventional assembly equipment. The height of the carrier ring also provides a means of providing integrated circuits with a predetermined thickness.
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