Electronic assembly
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United States of America Patent
Stats
-
Aug 29, 2000
Grant Date -
N/A
app pub date -
Aug 23, 1999
filing date -
Aug 23, 1999
priority date (Note) -
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status (Latency Note)
Importance
Abstract
An electronic assembly (1) having at least one semiconductor die (2) with external electrodes (3) has a foldable electrically insulating substrate (4) supporting a plurality of conductive leads (5) connected and mounted to respective ones of the electrodes (3). A plurality of external connectors (11) supported by the substrate (4) are electrically coupled to respective ones of the leads (5). The substrate (4) is folded at least once into a folded position to form at least two opposite facing surfaces (8, 9) with an adhesive and the die (2) at least partially sandwiched therebetween. The adhesive bonding the substrate (4) to the die (2) maintains the substrate (4) in the folded position.
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