Importance

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Abstract

A slurry recycle process for use in free-abrasive machining operations such as for wire saws used in wafer slicing of ingots, where the used slurry is separated into kerf-rich and abrasive-rich components, and the abrasive-rich component is reconstituted into a makeup slurry. During the process, the average particle size of the makeup slurry is controlled by monitoring the condition of the kerf and abrasive components and making necessary adjustments to the separating force and dwell time of the separator apparatus. Related pre-separator and post separator treatments, and feedback of one or the other separator slurry output components for mixing with incoming used slurry and recirculation through the separator, provide further effectiveness and additional control points in the process. The kerf-rich component is eventually or continually removed; the abrasive-rich component is reconstituted into a makeup slurry with a controlled, average particle size such that the products of the free-abrasive machining method using the recycled slurry process of the invention are of consistent high quality with less TTV deviation from cycle to cycle for a prolonged period or series of machining operations.

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First Claim