Heterolithic microwave integrated circuits
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Sep 5, 2000
Grant Date -
N/A
app pub date -
Apr 25, 1997
filing date -
Mar 22, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Silicon conductive vias and pedestals are disclosed for use in microwave integrated circuits. The pedestals are isolated from a ground plane on the bottom surface by glass, while the vias are used to make electrical contact to ground. Electrical circuit elements in the top surface of the integrated circuit are selectively grounded or isolated by the choice of connection to a via or pedestal, respectively.
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