Solder paste brick
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 5, 2000
Grant Date -
N/A
app pub date -
Jul 18, 1997
filing date -
Jul 18, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A solder paste brick, for attaching a ball grid array device to a circuit board. The solder paste brick is configured as an irregularly shaped structure so as to reduce distances in which volatized flux gasses must travel in order to escape from within the solder paste brick, thereby reducing voiding in a solder joint formed by the solder paste brick and a solder ball terminal of the ball grid array device as a result of a reflow soldering process. The solder paste brick is further configured so as to allow the solder ball terminal to make contact with a portion of an edge of the solder paste brick, while remaining substantially aligned with a center of a pad of the circuit board, such that a majority of a top surface of the solder paste brick is not in contact with the solder ball terminal. In this way, volatized flux gases formed during a reflow soldering process are caused to escape via the top surface without migrating upwardly into the solder ball terminal during the reflow soldering process.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully